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Patent Assignment Details
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Reel/Frame:017366/0710   Pages: 2
Recorded: 03/28/2006
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 2
1
Patent #:
Issue Dt:
05/26/1998
Application #:
08631616
Filing Dt:
04/10/1996
Title:
POLYPROPYLENE MOLDING COMPOSITION CONTAINING AN ANTISTATIC AGENT AND HAVING LOW-FOGGING PROPERTIES
2
Patent #:
Issue Dt:
10/05/1999
Application #:
08861592
Filing Dt:
05/22/1997
Title:
BLEND OF HIGH-MOLECULAR-WEIGHT POLYPROPYLENE AND HIGH-MOLECULAR-WEIGHT ENTHYLENE-PROPYLENE COPOLYMER WITH BROAD MOLECULAR WEIGHT DISTRIBUTION
Assignor
1
Exec Dt:
02/10/2006
Assignee
1
VIA PERGOLESI, 25
MILAN, ITALY 20124
Correspondence name and address
WILLIAM R. REID
912 APPLETON ROAD
BASELL USA INC.
ELKTON, MD 21921

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