Patent Assignment Details
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| Reel/Frame: | 017414/0285 | |
| Pages: | 3 |
| | Recorded: | 12/27/2005 | | |
| Attorney Dkt #: | 050432-0742 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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09/29/2015
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Application #:
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11317021
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Filing Dt:
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12/27/2005
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Title:
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Bondpad arrangement with reinforcing structures between the bondpads
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Assignee
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| ONE AMD PLACE, P.O. BOX 3453 |
| SUNNYVALE, CALIFORNIA 94088-3453 |
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Correspondence name and address
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MCDERMOTT WILL & EMERY LLP
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600 13TH STREET, N.W.
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WASHINGTON, D.C. 20005-3096
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