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Total properties:
69
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Patent #:
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Issue Dt:
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12/08/1981
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Application #:
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05855242
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Filing Dt:
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11/28/1977
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Title:
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METHOD OF FABRICATION A MULTI-LAYER STRUCTUE FOR DETECTOR ARRAY MODULE
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Patent #:
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Issue Dt:
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10/05/1982
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Application #:
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06206993
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Filing Dt:
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11/17/1980
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Title:
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DETECTOR ARRAY MODULE FABRICATION
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Patent #:
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Issue Dt:
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10/12/1982
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Application #:
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06206994
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Filing Dt:
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11/14/1980
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Title:
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DETECTOR ARRAY MODULE - STRUCTURE AND FABRICATION
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Patent #:
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Issue Dt:
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09/06/1983
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Application #:
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06213933
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Filing Dt:
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12/08/1980
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Title:
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DETECTOR ARRAY FOCAL PLANE CONFIGURATION
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Patent #:
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Issue Dt:
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12/25/1984
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Application #:
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06403004
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Filing Dt:
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07/29/1982
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Title:
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MULTIPLEXER CIRCUITRY FOR HIGH DENSITY ANALOG SIGNALS
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Patent #:
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Issue Dt:
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07/02/1985
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Application #:
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06517221
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Filing Dt:
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07/25/1983
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Title:
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HIGH-DENSITY ELECTRONIC PROCESSING PACKAGE-STRUCTURE AND FABRICATION
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Patent #:
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Issue Dt:
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11/26/1985
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Application #:
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06558099
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Filing Dt:
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12/05/1983
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Title:
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PRE-AMPLIFIER IN FOCAL PLANE DETECTOR ARRAY
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Patent #:
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Issue Dt:
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11/05/1985
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Application #:
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06572802
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Filing Dt:
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01/23/1984
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Title:
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DETECTOR ARRAY MODULE-STRUCTURE AND FABRICATION
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Patent #:
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Issue Dt:
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06/24/1986
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Application #:
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06661727
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Filing Dt:
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10/17/1984
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Title:
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CONSTANT CURRENT SOURCE FOR INTEGRATED CIRCUITS
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Patent #:
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Issue Dt:
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10/14/1986
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Application #:
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06674096
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Filing Dt:
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11/23/1984
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Title:
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METHOD FOR FABRICATING MODULES COMPRISING UNIFORMLY STACKED,ALIGNED CIRCUIT-CARRYING LAYERS
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Patent #:
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Issue Dt:
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02/24/1987
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Application #:
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06720902
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Filing Dt:
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04/08/1985
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Title:
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HIGH-DENSITY ELECTRONIC PROCESSING PACKAGE - STRUCTURE AND FABRICATION
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Patent #:
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Issue Dt:
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06/16/1987
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Application #:
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06761889
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Filing Dt:
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08/02/1985
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Title:
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DETECTOR ARRAY MODULE FABRICATION PROCESS
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Patent #:
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Issue Dt:
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06/23/1987
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Application #:
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06795988
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Filing Dt:
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11/06/1985
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Title:
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COMBINED STARING AND SCANNING PHOTODETECTOR SENSING SYSTEM HAVING BOTH TEMPORAL AND SPATIAL FILTERING
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Patent #:
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Issue Dt:
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11/03/1987
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Application #:
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06842159
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Filing Dt:
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03/21/1986
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Title:
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APPARATUS AND METHOD FOR FABRICATING MODULES COMPRISING STACKED CIRCUIT-CARRYING LAYERS
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Patent #:
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Issue Dt:
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11/10/1987
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Application #:
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06856835
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Filing Dt:
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04/25/1986
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Title:
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HIGH-DENSITY ELECTRONIC MODULES - PROCESS & PRODUCT
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Patent #:
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Issue Dt:
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08/16/1988
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Application #:
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07000562
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Filing Dt:
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01/05/1987
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Title:
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HIGH DENSITY ELECTRONIC PACKAGE COMPRISING STACKED SUB-MODULES
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Patent #:
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Issue Dt:
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02/21/1989
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07023644
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Filing Dt:
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03/09/1987
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Title:
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THERMAL IMAGER INCORPORATING ELECTRONICS MODULE HAVING FOCAL PLANE SENSOR MOSAIC
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Patent #:
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Issue Dt:
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12/13/1988
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Application #:
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07042686
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Filing Dt:
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04/27/1987
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Title:
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PRE-AMPLIFIER IN FOCAL PLANE DETECTOR ARRAY
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Patent #:
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Issue Dt:
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10/18/1988
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Application #:
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07048551
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Filing Dt:
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05/11/1987
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Title:
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Patent #:
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Issue Dt:
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03/27/1990
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07097797
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Filing Dt:
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09/16/1987
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Title:
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BONDING OF ALIGNED CONDUCTIVE BUMPS ON ADJACENT SURFACES
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Patent #:
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Issue Dt:
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03/21/1989
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Application #:
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07107352
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10/13/1987
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Title:
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PIXEL DISPLACEMENT BY SERIES- PARALLEL ANALOG SWITCHING
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Patent #:
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Issue Dt:
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01/08/1991
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Application #:
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07114415
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Filing Dt:
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10/28/1987
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Title:
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HIGH-DENSITY ELECTRONIC MODULES - PROCESS & PRODUCT
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Patent #:
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Issue Dt:
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09/03/1991
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07534969
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Filing Dt:
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06/06/1990
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Title:
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Patent #:
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Issue Dt:
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08/10/1993
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Application #:
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07651477
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Filing Dt:
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02/06/1991
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Title:
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HARDWARE FOR ELECTRONIC NEURAL NETWORK
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Patent #:
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Issue Dt:
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04/14/1992
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07720025
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Filing Dt:
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06/24/1991
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Title:
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METHOD OF FABRICATING ELECTRONIC CIRCUITRY UNIT CONTAINING STACKED IC LAYERS HAVING LEAD REROUTING
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Patent #:
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Issue Dt:
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04/19/1994
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Application #:
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07956914
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Filing Dt:
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10/05/1992
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Title:
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APPARATUS AND SYSTEM FOR CONTROLLABLY VARYING IMAGE RESOLUTION TO REDUCE DATA OUTPUT
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Patent #:
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Issue Dt:
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09/13/1994
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Application #:
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07985837
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Filing Dt:
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12/03/1992
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Title:
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MODULE COMPRISING IC MEMORY STACK DEDICATED TO AN STRUCTURALLY COMBINED WITH AN IC MICROPROCESSOR CHIP
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Patent #:
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Issue Dt:
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01/18/1994
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07996794
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12/24/1992
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Title:
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A METHOD FOR FABRICATING STACKS OF IC CHIPS BY SEGMENTING A LARGER STACK
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Patent #:
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Issue Dt:
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04/18/1995
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08120675
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09/13/1993
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Title:
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FABRICATION OF DENSE PARALLEL SOLDER BUMP CONNECTIONS
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07/11/1995
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Application #:
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08178923
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01/07/1994
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Title:
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APPARATUS FOR SEGMENTING STACKED IC CHIPS
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Patent #:
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06/13/1995
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08232739
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04/25/1994
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Title:
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NON-CONDUCTIVE END LAYER FOR INTEGRATED STACK OF IC CHIPS
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Patent #:
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07/11/1995
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08255465
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Filing Dt:
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06/08/1994
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Title:
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ELECTRONIC MODULE COMPRISING A STACK OF IC CHIPS EACH INTERACTING WITH AN IC CHIP SECURED TO THE STACK
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Patent #:
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04/16/1996
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08305066
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09/13/1994
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INFRARED WIRELESS COMMUNICATION BETWEEN ELECTRONIC SYSTEM COMPONENTS
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12/03/1996
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08326645
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10/20/1994
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Title:
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STACK OF IC CHIPS IN LIEU OF SINGLE IC CHIP
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Patent #:
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12/23/1997
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08376799
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01/23/1995
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STACKABLE MODULES AND MULTIMODULAR ASSEMBLIES
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Patent #:
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06/03/1997
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08526415
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09/11/1995
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Title:
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Patent #:
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04/28/1998
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08592691
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01/26/1996
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SELF-ALIGNING OPTICAL BEAM SYSTEM
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11/18/1997
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08622671
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03/26/1996
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09/14/1999
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08777747
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12/21/1996
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STACKABLE LAYERS CONTAINING ENCAPSULATED IC CHIPS
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02/27/2001
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09031435
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02/26/1998
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02/22/2000
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09095415
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06/10/1998
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01/11/2000
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09095416
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06/10/1998
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09/21/1999
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09166458
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10/05/1998
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MULTI- ELEMENT MICRO GYRO
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05/14/2002
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09223476
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12/30/1998
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05/16/2002
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Title:
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NEURAL PROCESSING MODULE WITH INPUT ARCHITECTURES THAT MAKE MAXIMAL USE OF A WEIGHTED SYNAPSE ARRAY
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09/12/2000
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09282704
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03/31/1999
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STACKABLE LAYERS CONTAINING ENCAPSULATED CHIPS
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07/18/2000
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04/29/1999
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06/06/2000
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09316740
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05/21/1999
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11/18/2003
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10/25/1999
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06/17/2003
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06/26/2000
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11/05/2002
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09853819
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05/11/2001
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11/14/2002
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Title:
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METHOD AND APPARATUS FOR TEMPERATURE COMPENSATION OF AN UNCOOLED FOCAL PLANE ARRAY
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07/22/2003
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08/03/2001
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02/06/2003
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Title:
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RETRO-REFLECTOR WARM STOP FOR UNCOOLED THERMAL IMAGING CAMERAS AND METHOD OF USING THE SAME
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09/28/2004
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09938686
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10/30/2001
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05/01/2003
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METHOD OF MAKING STACKABLE LAYERS CONTAINING ENCAPSULATED INTEGRATED CIRCUIT CHIPS WITH ONE OR MORE OVERLAYING INTERCONNECT LAYERS
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05/11/2004
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09/07/2001
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03/13/2003
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MULTILAYER MODULES WITH FLEXIBLE SUBSTRATES
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05/06/2003
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09/07/2001
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03/13/2003
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STACK OF MULTILAYER MODULES WITH HEAT-FOCUSSING METAL LAYER
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04/06/2004
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09/07/2001
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03/13/2003
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12/07/2004
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10/09/2001
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10/31/2002
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HIGH SPEED MULTI-STAGE SWITCHING NETWORK FORMED FROM STACKED SWITCHING LAYERS
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10/19/2004
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04/22/2002
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10/23/2003
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03/16/2004
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05/10/2002
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09/12/2002
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STACKABLE MICROCIRCUIT LAYER FORMED FROM A PLASTIC ENCAPSULATED MICROCIRCUIT AND METHOD OF MAKING THE SAME
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07/16/2002
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12/05/2002
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Wearable biomonitor with flexible thinned integrated circuit
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05/10/2005
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10/25/2002
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07/03/2003
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08/31/2004
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11/21/2002
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07/10/2003
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07/25/2006
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01/17/2003
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02/26/2004
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02/15/2005
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01/17/2003
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12/04/2003
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11/22/2005
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02/07/2003
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01/08/2004
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07/05/2005
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07/08/2003
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01/15/2004
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CRYOPUMP PISTON POSITION TRACKING
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10663371
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Filing Dt:
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09/16/2003
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Publication #:
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Pub Dt:
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06/17/2004
| | | | |
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Title:
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Stacked microelectronic module with vertical interconnect vias
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|
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Patent #:
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Issue Dt:
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08/26/2008
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Application #:
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10703177
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Filing Dt:
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11/06/2003
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Publication #:
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Pub Dt:
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07/29/2004
| | | | |
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Title:
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NEO-WAFER DEVICE AND METHOD
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|
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10805849
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Filing Dt:
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03/22/2004
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Publication #:
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Pub Dt:
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09/30/2004
| | | | |
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Title:
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Three-dimensional imaging device incorporating stacked layers containing microelectronic circuits
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11003429
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Filing Dt:
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12/06/2004
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Publication #:
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Pub Dt:
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05/05/2005
| | | | |
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Title:
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Wearable biomonitor with flexible thinned integrated circuit
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