Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 017461/0097 | |
| Pages: | 2 |
| | Recorded: | 05/11/2005 | | |
| Attorney Dkt #: | 59559.00020 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10534488
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Filing Dt:
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05/11/2005
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Publication #:
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Pub Dt:
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03/09/2006
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Title:
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Molding die,molding method, disc substrate, and molding machine
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Assignees
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| 9-11, KITASHINAGAWA 5-CHOME |
| SHINAGAWA-KU, TOKYO 141-8686, JAPAN |
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| 296-1, MATSUHIDAI |
| MATSUDO-SHI, CHIBA 270-2214, JAPAN |
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Correspondence name and address
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SQUIRE SANDERS & DEMPSEY L.L.P.
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8000 TOWERS CRESCENT DRIVE, 14TH FLOOR
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TYSONS CORNER, VIRGINIA 22182-2700
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