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Patent Assignment Details
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Reel/Frame:017487/0208   Pages: 4
Recorded: 04/18/2006
Attorney Dkt #:KOMOP0113US
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
NONE
Issue Dt:
Application #:
10595424
Filing Dt:
04/18/2006
Publication #:
Pub Dt:
06/14/2007
Title:
Semiconductor chip mounted interposer, semiconductor device, semiconductor chip interposer fabrication method, bare chip mounted interposer, and interposer sheet
Assignors
1
Exec Dt:
04/12/2006
2
Exec Dt:
04/12/2006
3
Exec Dt:
04/12/2006
Assignee
1
AMAGASAKI RESEARCH INCUBATION CENTER
1-3, 7-CHOME, DOUI-CHO
AMAGASAKI-SHI, HYOGO, JAPAN 660-0083
Correspondence name and address
MARK D SARALINO
RENNER, OTTO, BOISSELLE & SKLAR, LLP
1621 EUCLID AVENUE, NINETEENTH FLOOR
CLEVELAND, OH 44115

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