Patent Assignment Details
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Reel/Frame: | 017491/0176 | |
| Pages: | 3 |
| | Recorded: | 04/17/2006 | | |
Attorney Dkt #: | 884.F83US1 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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02/19/2008
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Application #:
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11323512
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Filing Dt:
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12/30/2005
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Publication #:
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Pub Dt:
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07/12/2007
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Title:
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CHIP PACKAGE THERMAL INTERFACE MATERIALS WITH DIELECTRIC OBSTRUCTIONS FOR BODY-BIASING, METHODS OF USING SAME, AND SYSTEMS CONTAINING SAME
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Assignee
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2200 MISSION COLLEGE BLVD. |
SANTA CLARA, CALIFORNIA 95052 |
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Correspondence name and address
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ANN M. MCCRACKIN
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SCHWEGMAN LUNDBERG WOESSNER, ET AL.
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P.O. BOX 2938
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MINNEAPOLIS, MN 55402
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