skip navigationU S P T O SealUnited States Patent and Trademark Office AOTW logo
Home|Site Index|Search|Guides|Contacts|eBusiness|eBiz alerts|News|Help
Assignments on the Web > Patent Query
Patent Assignment Details
NOTE:Results display only for issued patents and published applications. For pending or abandoned applications please consult USPTO staff.

Reel/Frame:017501/0976   Pages: 2
Recorded: 01/24/2006
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
04/22/2008
Application #:
11337646
Filing Dt:
01/24/2006
Publication #:
Pub Dt:
04/12/2007
Title:
MOLDED RESIN OBJECT, ELECTRONIC INSTRUMENT USING THE SAME, AND METHOD OF PROCESSING A MOLDED RESIN OBJECT
Assignors
1
Exec Dt:
01/06/2006
2
Exec Dt:
01/06/2006
3
Exec Dt:
01/06/2006
4
Exec Dt:
01/06/2006
Assignee
1
1-1, KAMIKODANAKA 4-CHOME
NAKAHARA-KU, KAWASAKI-SHI
KANAGAWA 211-8588, JAPAN
Correspondence name and address
STAAS & HALSEY LLP
ATTENTION: H.J. STAAS
1201 NEW YORK AVE., N.W.,SUITE 700
WASHINGTON, D.C. 20005

Search Results as of: 05/01/2024 01:46 AM
If you have any comments or questions concerning the data displayed, contact PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified: August 25, 2017 v.2.6
| .HOME | INDEX| SEARCH | eBUSINESS | CONTACT US | PRIVACY STATEMENT