Patent Assignment Details
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| Reel/Frame: | 017511/0483 | |
| Pages: | 3 |
| | Recorded: | 01/25/2006 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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06/01/2010
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Application #:
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11339767
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Filing Dt:
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01/25/2006
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Publication #:
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Pub Dt:
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08/03/2006
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Title:
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BUCKLE, INJECTION MOLDING DIE AND INJECTION MOLDING METHOD
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Assignee
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| 1, KANDAIZUMI-CHO |
| CHIYODA-KU |
| TOKYO, JAPAN 101-8642 |
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Correspondence name and address
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MICHAEL S. LEONARD
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EVEREST INTELLECTUAL PROPERTY LAW GROUP
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P.O. BOX 708
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NORTHBROOK, IL 60065
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