Patent Assignment Details
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Reel/Frame: | 017532/0957 | |
| Pages: | 3 |
| | Recorded: | 01/27/2006 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11342188
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Filing Dt:
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01/27/2006
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Publication #:
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Pub Dt:
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05/31/2007
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Title:
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Two-step high bottleneck type capillary for wire bonding device
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Assignee
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168-22 SAMSUNG-DONG, GANGNAM-GU |
SEOUL 135-280, KOREA, REPUBLIC OF |
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Correspondence name and address
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PETER T. KWON
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GWIPS
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P.O. BOX 231630
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CENTREVILLE, VIRGINIA 20120
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