Patent Assignment Details
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| Reel/Frame: | 017543/0558 | |
| Pages: | 2 |
| | Recorded: | 02/06/2006 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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01/05/2010
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Application #:
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11347292
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Filing Dt:
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02/06/2006
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Publication #:
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Pub Dt:
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08/10/2006
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Title:
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SEMICONDUCTOR DEVICE INCLUDING CAPSULE TYPE SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR CHIP IN STACKING MANNER
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Assignee
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| 4-1, MARUNOUCHI 2-CHOME |
| CHIYODA-KU, TOKYO 100-6334, JAPAN |
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Correspondence name and address
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MCDERMOTT WILL & EMERY LLP
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600 13TH STREET, N.W.
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WASHINGTON, DC 20005-3096
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