Patent Assignment Details
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| Reel/Frame: | 017572/0084 | |
| Pages: | 4 |
| | Recorded: | 02/17/2006 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11356396
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Filing Dt:
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02/17/2006
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Publication #:
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Pub Dt:
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08/24/2006
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Title:
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Lead frame, sensor including lead frame, resin composition to be used for resin mold in the sensor, and sensor including the resin mold
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Assignee
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| 10-1, NAKAZAWA-CHO |
| HAMAMATSU-SHI |
| SHIZUOKA-KEN, JAPAN |
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Correspondence name and address
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MICHAEL J. SCHEER
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DICKSTEIN SHAPIRO MORIN, ET AL.
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1177 AVENUE OF THE AMERICAS, 41ST FLOOR
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NEW YORK, NY 10038-2714
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