Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 017572/0420 | |
| Pages: | 2 |
| | Recorded: | 01/23/2006 | | |
| Attorney Dkt #: | 073752-0017 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11288407
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Filing Dt:
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11/29/2005
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Publication #:
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Pub Dt:
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06/01/2006
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Title:
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Resin bond grindstone and method of manufacturing a semiconductor chip using the grindstone
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Assignees
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| 2-1, YAESU 2-CHOME |
| CHUO-KU |
| TOKYO 104-0028, JAPAN |
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| 6-6, MARUNOUCHI 1-CHOME |
| CHIYODA-KU, TOKYO, JAPAN |
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Correspondence name and address
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MCDERMOTT WILL & EMERY LLP
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600 13TH STREET, N.W.
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WASHINGTON, DC 20005-3096
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