Patent Assignment Details
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| Reel/Frame: | 017624/0039 | |
| Pages: | 3 |
| | Recorded: | 03/01/2006 | | |
| Attorney Dkt #: | NEC-629-US/TN |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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11/18/2008
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Application #:
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11364274
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Filing Dt:
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03/01/2006
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Publication #:
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Pub Dt:
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09/07/2006
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Title:
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METHOD FOR MANUFACTURING FLIP-CHIP TYPE SEMICONDUCTOR DEVICE FEATURING NICKEL ELECTRODE PADS, AND PLATING APPARATUS USED IN SUCH METHOD
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Assignee
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| 1753 SHIMONUMABE, NAKAHARA-KU |
| KAWASAKI, KANAGAWA, JAPAN 211-8668 |
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Correspondence name and address
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SEAN M. MCGINN, ESQ.
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MCGINN INTELLECTUAL PROP. LAW GROUP,PLLC
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8321 OLD COURTHOUSE ROAD
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SUITE 200
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VIENNA, VA 22182-3817
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