Patent Assignment Details
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| Reel/Frame: | 017685/0353 | |
| Pages: | 7 |
| | Recorded: | 05/26/2006 | | |
| Attorney Dkt #: | CPAC 1118-2.2 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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09/30/2008
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Application #:
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11397027
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Filing Dt:
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03/31/2006
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Publication #:
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Pub Dt:
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10/05/2006
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Title:
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SEMICONDUCTOR ASSEMBLY INCLUDING CHIP SCALE PACKAGE AND SECOND SUBSTRATE WITH EXPOSED SURFACES ON UPPER AND LOWER SIDES
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Assignee
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| 10 ANG MO KIO STREET 65, #05-17/20 TECHPOINT |
| SINGAPORE, SINGAPORE 569059 |
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Correspondence name and address
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BILL KENNEDY
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HAYNES BEFFEL & WOLFELD LLP
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P.O. BOX 366
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HALF MOON BAY, CA 94019
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