Patent Assignment Details
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| Reel/Frame: | 017717/0335 | |
| Pages: | 3 |
| | Recorded: | 06/03/2006 | | |
| Attorney Dkt #: | 061063-0316598 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10540992
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Filing Dt:
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06/05/2006
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Publication #:
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Pub Dt:
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11/02/2006
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Title:
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Chemical-mechanical-polishing slurry composition, method for planarizing surface of semiconductor device using the same, and method for controlling selection ratio of slurry composition
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Assignees
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| 2-1, SHIBAURA 1-CHOME, MINATO-KU |
| TOKYO, JAPAN |
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| 17 HAENGDANG 1-DONG, SEONGDONG-GU |
| SEOUL, KOREA, REPUBLIC OF |
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Correspondence name and address
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JEFFREY D. KARCESKI
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1650 TYSONS BOULEVARD
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MCLEAN, VA 22102
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