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Reel/Frame:017724/0891   Pages: 9
Recorded: 06/05/2006
Attorney Dkt #:SAND-01107US0
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
11/04/2014
Application #:
11414526
Filing Dt:
04/28/2006
Publication #:
Pub Dt:
11/01/2007
Title:
Molded SiP package with reinforced solder columns
Assignors
1
Exec Dt:
04/28/2006
2
Exec Dt:
04/27/2006
3
Exec Dt:
04/28/2006
4
Exec Dt:
04/28/2006
5
Exec Dt:
04/28/2006
6
Exec Dt:
04/28/2006
Assignee
1
140 CASPIAN COURT
SUNNYVALE, CALIFORNIA 94089
Correspondence name and address
BRIAN I. MARCUS
575 MARKET STREET, SUITE 2500
SAN FRANCISCO, CA 94105

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