Patent Assignment Details
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Reel/Frame: | 017740/0799 | |
| Pages: | 4 |
| | Recorded: | 04/06/2006 | | |
Attorney Dkt #: | SC14724TK |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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08/10/2010
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Application #:
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11398944
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Filing Dt:
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04/06/2006
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Publication #:
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Pub Dt:
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10/11/2007
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Title:
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LEAD FRAME BASED, OVER-MOLDED SEMICONDUCTOR PACKAGE WITH INTEGRATED THROUGH HOLE TECHNOLOGY (THT) HEAT SPREADER PIN(S) AND ASSOCIATED METHOD OF MANUFACTURING
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Assignee
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6501 WILLIAM CANNON DRIVE WEST |
AUSTIN, TEXAS 78735 |
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Correspondence name and address
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FREESCALE SEMICONDUCTOR, INC.
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LAW DEPARTMENT
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7700 W. PARMER LANE, MD: TX32/PL02
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AUSTIN, TX 78729
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