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Reel/Frame:017775/0816   Pages: 7
Recorded: 04/07/2006
Attorney Dkt #:A9366.2/T60030
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
8129290
Issue Dt:
03/06/2012
Application #:
11400275
Filing Dt:
04/07/2006
Publication #:
US20060269693
Pub Dt:
11/30/2006
Title:
METHOD TO INCREASE TENSILE STRESS OF SILICON NITRIDE FILMS USING A POST PECVD DEPOSITION UV CURE
Assignors
1
BALSEANU, MIHAELA
Exec Dt:
03/31/2006
2
COX, MICHAEL S.
Exec Dt:
04/06/2006
3
XIA, LI-QUN
Exec Dt:
03/31/2006
4
SHEK, MEI-YEE
Exec Dt:
04/03/2006
5
LEE, JIA
Exec Dt:
03/31/2006
6
ZUBKOV, VLADIMIR
Exec Dt:
03/31/2006
7
HUANG, TZU-FANG
Exec Dt:
03/31/2006
8
WANG, RONGPING
Exec Dt:
04/03/2006
9
ROFLOX, ISABELITA
Exec Dt:
03/31/2006
10
M'SAAD, HICHEM
Exec Dt:
03/31/2006
Assignee
1
APPLIED MATERIALS, INC.
P.O. BOX 450A
LEGAL AFFAIRS DEPARTMENT
SANTA CLARA, CALIFORNIA 95052
Correspondence name and address
KENT J. TOBIN
TOWNSEND AND TOWNSEND AND CREW LLP
TWO EMBARCADERO CENTER
EIGHT FLOOR
SAN FRANCISCO, CALIFORNIA 94111-3834

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