Patent Assignment Details
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| Reel/Frame: | 017784/0783 | |
| Pages: | 3 |
| | Recorded: | 04/12/2006 | | |
| Attorney Dkt #: | NEC-634-US/TN |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11402008
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Filing Dt:
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04/12/2006
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Publication #:
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Pub Dt:
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10/19/2006
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Title:
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BGA type semiconductor package featuring additional flat electrode teminals, and method for manufacturing the same
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Assignee
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| 1753 SHIMONUMABE, NAKAHARA-KU |
| KAWASAKI, KANAGAWA 211-8668, JAPAN |
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Correspondence name and address
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SEAN M. MCGINN
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MCGINN INTELLECTUAL PROPERTY LAW GROUP
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8321 OLD COURTHOUSE ROAD
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SUITE 200
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VIENNA, VIRGINIA 22182-3817
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