Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 017789/0260 | |
| Pages: | 2 |
| | Recorded: | 04/12/2006 | | |
| Attorney Dkt #: | 040894-7359 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11302503
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Filing Dt:
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12/14/2005
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Publication #:
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Pub Dt:
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08/03/2006
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Title:
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Ultrasonic wire bonding method and ultrasonic wire bonding apparatus
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Assignee
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| 4-28, MITA 1-CHOME, MINATO-KU |
| TOKYO, JAPAN |
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Correspondence name and address
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MORGAN LEWIS & BOCKIUS LLP
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1111 PENNSYLVANIA AVENUE NW
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WASHINGTON, DC 20004
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05/03/2024 01:59 PM
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