Patent Assignment Details
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| Reel/Frame: | 017798/0378 | |
| Pages: | 2 |
| | Recorded: | 06/16/2006 | | |
| Attorney Dkt #: | 060259 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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02/23/2010
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Application #:
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11387769
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Filing Dt:
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03/24/2006
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Publication #:
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Pub Dt:
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09/27/2007
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Title:
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METHOD FOR BONDING HEATSINK AND SEMICONDUCTOR DEVICE WITH HEATSINK
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Assignee
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| 1-1, KAMIKODANAKA 4-CHOME, NAKAHARA-KU, |
| KAWASAKI-SHI, KANAGAWA, JAPAN 211-8588 |
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Correspondence name and address
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ARMSTRONG, KRATZ, QUINTOS, HANSON & BROO
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1725 K STREET, NW
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SUITE 1000
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WASHINGTON, DC 20006
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