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Total properties:
14
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Patent #:
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Issue Dt:
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08/27/1991
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Application #:
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07587308
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Filing Dt:
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09/24/1990
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Title:
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INTEGRATED CIRCUIT PACKAGE AND COMPACT ASSEMBLIES THEREOF
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Patent #:
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Issue Dt:
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09/29/1992
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Application #:
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07724561
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Filing Dt:
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06/28/1991
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Title:
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SOLDER PASTE
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Patent #:
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Issue Dt:
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11/23/1993
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Application #:
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07809694
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Filing Dt:
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12/17/1991
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Title:
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PSEUDO-ELECTROLESS, FOLLOWED BY ELECTROLESS, METALLIZATION OF NICKEL ON METALLIC WIRES, AS FOR SEMICONDUCTOR CHIP-TO-CHIP INTERCONNECTIONS
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Patent #:
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Issue Dt:
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08/10/1993
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Application #:
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07938194
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Filing Dt:
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08/28/1992
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Title:
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DEBONDABLE METALLIC BONDING METHOD
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Patent #:
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Issue Dt:
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08/10/1993
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Application #:
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07938195
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Filing Dt:
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08/28/1992
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Title:
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PERMANENT METALLIC BONDING METHOD
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Patent #:
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Issue Dt:
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05/18/1993
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Application #:
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07973908
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Filing Dt:
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11/10/1992
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Title:
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SOLDER PASTE AND METHOD OF USING THE SAME
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Patent #:
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Issue Dt:
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05/03/1994
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Application #:
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08054505
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Filing Dt:
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04/27/1993
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Title:
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METHOD OF MAKING AN ARTICLE COMPRISING SOLDER BUMP BONDING
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Patent #:
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Issue Dt:
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09/13/1994
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Application #:
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08128492
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Filing Dt:
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09/28/1993
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Title:
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SURFACE MOUNT SOLDER ASSEMBLY OF LEADLESS INTEGRATED CIRCUIT PACKAGES TO SUBSTRATES
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Patent #:
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Issue Dt:
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10/24/1995
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Application #:
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08200986
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Filing Dt:
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02/24/1994
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Title:
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MULTI-CHIP MODULES HAVING CHIP-TO-CHIP INTERCONNECTIONS WITH REDUCED SIGNAL VOLTAGE LEVEL AND SWING
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Patent #:
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Issue Dt:
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05/14/1996
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Application #:
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08220771
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Filing Dt:
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03/31/1994
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Title:
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PROCESS FOR FABRICATING AN INTEGRATED CIRCUIT
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Patent #:
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Issue Dt:
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12/05/1995
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Application #:
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08260859
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Filing Dt:
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06/16/1994
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Title:
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ELECTRONIC DEVICE PACKAGE HAVING ELECTRONIC DEVICE BONDED, AT A LOCALIZED REGION THEREOF, TO CIRCUIT BOARD
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Patent #:
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Issue Dt:
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04/09/1996
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Application #:
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08333168
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Filing Dt:
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11/02/1994
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Title:
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METHOD FOR BUMPING SILICON DEVICES
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Patent #:
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Issue Dt:
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01/02/1996
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Application #:
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08344393
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Filing Dt:
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11/23/1994
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Title:
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TEMPORARY CONNECTIONS FOR FAST ELECTRICAL ACCESS TO ELECTRONIC DEVICES
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Patent #:
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Issue Dt:
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07/09/1996
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Application #:
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08370902
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Filing Dt:
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01/10/1995
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Title:
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METHOD FOR MAKING MULTICHIP CIRCUITS USING ACTIVE SEMICONDUCTOR SUBSTRATES
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