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Patent Assignment Details

NOTE:Results display only for issued patents and published applications. For pending or abandoned applications please consult USPTO staff.

Reel/Frame:	017811/0404			Pages:	16
		Recorded:	04/25/2006
Conveyance:	ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).

Total properties: 20

Patent #:	6077725	Issue Dt:	06/20/2000	Application #:	07940157	Filing Dt:	09/03/1992
Title:	METHOD FOR ASSEMBLING MULTICHIP MODULES

Patent #:	5307983	Issue Dt:	05/03/1994	Application #:	08054505	Filing Dt:	04/27/1993
Title:	METHOD OF MAKING AN ARTICLE COMPRISING SOLDER BUMP BONDING

Patent #:	5608262	Issue Dt:	03/04/1997	Application #:	08393628	Filing Dt:	02/24/1995
Title:	PACKAGING MULTI-CHIP MODULES WITHOUT WIRE-BOND INTERCONNECTION

Patent #:	5622305	Issue Dt:	04/22/1997	Application #:	08438296	Filing Dt:	05/10/1995
Title:	BONDING SCHEME USING GROUP VB METALLIC LAYER

Patent #:	6029224	Issue Dt:	02/22/2000	Application #:	08477175	Filing Dt:	06/07/1995
Title:	SELF-CONTAINED MEMORY APPARATUS HAVING DIVERSE TYPES OF MEMORY AND DISTRIBUTED CONTROL

Patent #:	5564617	Issue Dt:	10/15/1996	Application #:	08479587	Filing Dt:	06/07/1995
Title:	METHOD AND APPARATUS FOR ASSEMBLING MULTICHIP MODULES

Patent #:	5646828	Issue Dt:	07/08/1997	Application #:	08697121	Filing Dt:	08/20/1996
Title:	THIN PACKAGING OF MULTI-CHIP MODULES WITH ENHANCED THERMAL POWER MANAGEMENT

Patent #:	5747982	Issue Dt:	05/05/1998	Application #:	08761047	Filing Dt:	12/05/1996
Title:	MULTI-CHIP MODULES WITH ISOLATED COUPLING BETWEEN MODULES

Patent #:	5778913	Issue Dt:	07/14/1998	Application #:	08803474	Filing Dt:	02/20/1997
Title:	CLEANING SOLDER-BONDED FLIP-CHIP ASSEMBLIES

Patent #:	5904859	Issue Dt:	05/18/1999	Application #:	08825923	Filing Dt:	04/02/1997
Title:	FLIP CHIP METALLIZATION

Patent #:	5990564	Issue Dt:	11/23/1999	Application #:	08866264	Filing Dt:	05/30/1997
Title:	FLIP CHIP PACKAGING OF MEMORY CHIPS

Patent #:	5869894	Issue Dt:	02/09/1999	Application #:	08896917	Filing Dt:	07/18/1997
Title:	RF IC PACKAGE

Patent #:	5898223	Issue Dt:	04/27/1999	Application #:	08946980	Filing Dt:	10/08/1997
Title:	CHIP-ON-CHIP IC PACKAGES

Patent #:	6043670	Issue Dt:	03/28/2000	Application #:	08991867	Filing Dt:	12/16/1997
Title:	METHOD FOR TESTING INTEGRATED CIRCUITS

Patent #:	6075427	Issue Dt:	06/13/2000	Application #:	09012304	Filing Dt:	01/23/1998
Title:	MCM WITH HIGH Q OVERLAPPING RESONATOR

Patent #:	6015652	Issue Dt:	01/18/2000	Application #:	09032338	Filing Dt:	02/27/1998
Title:	MANUFACTURE OF FLIP-CHIP DEVICE

Patent #:	6154370	Issue Dt:	11/28/2000	Application #:	09120148	Filing Dt:	07/21/1998
Title:	RECESSED FLIP-CHIP PACKAGE

Patent #:	6205745	Issue Dt:	03/27/2001	Application #:	09134843	Filing Dt:	08/14/1998
Title:	HIGH SPEED FLIP-CHIP DISPENSING

Patent #:	6160715	Issue Dt:	12/12/2000	Application #:	09149804	Filing Dt:	09/08/1998
Title:	TRANSLATOR FOR RECESSED FLIP-CHIP PACKAGE

Patent #:	6074897	Issue Dt:	06/13/2000	Application #:	09238706	Filing Dt:	01/28/1999
Title:	INTEGRATED CIRCUIT BONDING METHOD AND APPARATUS

Assignor

Exec Dt:

01/30/2001

Assignee

1110 AMERICAN PARKWAY NE

ALLENTOWN, PENNSYLVANIA 18109

Correspondence name and address
	DOCKET ADMINISTRATOR
	AGERE SYSTEMS INC.
	ROOM 4U-533C
	FOUR CONNELL DRIVE
	BERKELEY HEIGHTS, NJ 07922-2747

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