Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Reel/Frame: | 017817/0125 | |
| Pages: | 2 |
| | Recorded: | 04/25/2006 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
|
Total properties:
1
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
11410035
|
Filing Dt:
|
04/25/2006
|
Publication #:
|
|
Pub Dt:
|
11/16/2006
| | | | |
Title:
|
Manufacturing method for semiconductor wafers, slicing method for slicing work and wire saw used for the same
|
|
Assignees
|
|
|
26-2, MINAMI-OHI 6-CHOME |
SHINAGAWA-KU, TOKYO, JAPAN |
|
|
|
13-11, OMORI-KITA 2-CHOME |
OTA-KU, TOKYO 143-8580, JAPAN |
|
Correspondence name and address
|
|
SUGHRUE MION, PLLC
|
|
2100 PENNSYLVANIA AVENUE, N.W.
|
|
SUITE 800
|
|
WASHINGTON, DC 20037
|
Search Results as of:
05/02/2024 10:41 PM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|