Patent Assignment Details
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| Reel/Frame: | 017837/0889 | |
| Pages: | 4 |
| | Recorded: | 06/22/2006 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11402675
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Filing Dt:
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04/12/2006
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Publication #:
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Pub Dt:
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10/18/2007
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Title:
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Manufacturing method for an integrated semiconductor contact structure having an improved aluminum fill
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Assignee
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| ST. MARTIN STR. 53 |
| MUNICH, GERMANY D-81669 |
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Correspondence name and address
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RICHARD E. JENKINS
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JENKINS WILSON TAYLOR ET AL.
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SUITE 1200, UNIVERSITY TOWER
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3100 TOWER BLVD.
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DURHAM, NC 27707
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