Patent Assignment Details
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Reel/Frame: | 017847/0459 | |
| Pages: | 3 |
| | Recorded: | 06/23/2006 | | |
Attorney Dkt #: | M-16167 US |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11431223
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Filing Dt:
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05/09/2006
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Publication #:
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Pub Dt:
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11/15/2007
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Title:
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Method for providing STI structures with high coupling ratio in integrated circuit manufacturing
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Assignee
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30 TOH GUAN ROAD |
#08-09 ODC DISTRICENTRE |
SINGAPORE 608840, SINGAPORE |
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Correspondence name and address
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EDWARD C. KWOK
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MACPHERSON, KWOK CHEN & HEID LLP
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1762 TECHNOLOGY DRIVE, SUITE 226
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SAN JOSE, CA 95110
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