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Reel/Frame:017936/0400   Pages: 3
Recorded: 05/30/2006
Attorney Dkt #:069576-0070
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
02/16/2010
Application #:
11442414
Filing Dt:
05/30/2006
Publication #:
Pub Dt:
11/30/2006
Title:
HIGH POWER LIGHT EMITTING DIODE PACKAGE AND FABRICATION METHOD THEREOF
Assignors
1
Exec Dt:
04/17/2006
2
Exec Dt:
04/17/2006
3
Exec Dt:
04/17/2006
4
Exec Dt:
04/17/2006
5
Exec Dt:
04/17/2006
6
Exec Dt:
04/17/2006
Assignee
1
314 MAETAN-3-DONG, YOUNGTONG-KU, SUWON
KYUNGKI-DO, KOREA, REPUBLIC OF
Correspondence name and address
MCDERMOTT WILL & EMERY LLP
600 13TH STREET, N.W.
WASHINGTON, D.C. 20005-3096

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