Patent Assignment Details
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| Reel/Frame: | 017938/0270 | |
| Pages: | 2 |
| | Recorded: | 05/31/2006 | | |
| Attorney Dkt #: | 403720/TAKADA |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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01/25/2011
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Application #:
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11443367
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Filing Dt:
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05/31/2006
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Publication #:
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Pub Dt:
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05/10/2007
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Title:
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METHOD OF INSPECTING SEMICONDUCTOR DEVICE CHIP PATTERNS ON A WAFER
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Assignee
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| 7-3, MARUNOUCHI 2-CHOME, CHIYODA-KU |
| TOKYO, JAPAN 100-8310 |
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Correspondence name and address
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JEFFREY A. WYAND
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LEYDIG, VOIT & MAYER
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700 THIRTEENTH ST., N.W., SUITE 300
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WASHINGTON, D.C. 20005-3960
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