Patent Assignment Details
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| Reel/Frame: | 017965/0573 | |
| Pages: | 3 |
| | Recorded: | 06/05/2006 | | |
| Attorney Dkt #: | 0756-7719 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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07/28/2009
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Application #:
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10581674
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Filing Dt:
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06/05/2006
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Publication #:
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Pub Dt:
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07/19/2007
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Title:
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METHOD FOR MANUFACTURING THIN FILM INTEGRATED CIRCUIT DEVICE, NONCONTACT THIN FILM INTEGRATED CIRCUIT DEVICE AND METHOD FOR MANUFACTURING THE SAME, AND IDTAG AND COIN INCLUDING THE NONCONTACT THIN FILM INTEGRATED CIRCUIT DEVICE
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Assignee
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| 398, HASE ATSUGI-SHI |
| KANAGAWA-KEN, JAPAN 243-0036 |
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Correspondence name and address
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ERIC J. ROBINSON
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ROBINSON INTELLECTUAL PROP. LAW OFFICE
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PMB 955
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21010 SOUTHBANK STREET
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POTOMAC FALLS, VA 20165
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