Patent Assignment Details
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| Reel/Frame: | 017969/0736 | |
| Pages: | 2 |
| | Recorded: | 06/13/2006 | | |
| Attorney Dkt #: | 403734/TAKADA |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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10/29/2013
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Application #:
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11451372
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Filing Dt:
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06/13/2006
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Publication #:
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Pub Dt:
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06/14/2007
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Title:
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Semiconductor device having a molded package
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Assignee
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| 7-3, MARUNOUCHI 2-CHOME |
| CHIYODA-KU, TOKYO, JAPAN 100-8310 |
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Correspondence name and address
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JEFFREY A. WYAND
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LEYDIG VOIT & MAYER
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700 13TH ST., NW
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SUITE 300
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WASHINGTON, DC 20005-3960
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