Patent Assignment Details
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| Reel/Frame: | 017981/0268 | |
| Pages: | 2 |
| | Recorded: | 06/05/2006 | | |
| Attorney Dkt #: | 24172US 3876P |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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05/27/2008
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Application #:
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11447584
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Filing Dt:
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06/05/2006
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Publication #:
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Pub Dt:
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12/07/2006
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Title:
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METAL ELECTROPLATING PROCESS OF AN ELECTRICALLY CONNECTING PAD STRUCTURE OF CIRCUIT BOARD AND STRUCTURE THEREOF
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Assignees
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| NO. 6, LI-HSIN ROAD |
| SCIENCE-BASED INDUSTRIAL PARK |
| HSIN-CHU, TAIWAN R.O.C. |
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| NO. 10-1, JEN-YI ROAD |
| HSINCHU INDUSTRIAL PARK |
| HSIN-CHU, TAIWAN R.O.C. |
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Correspondence name and address
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SAWYER LAW GROUP LLP
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P.O. BOX 51418
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PALO ALTO, CA 94303
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