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Patent Assignment Details
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Reel/Frame:017987/0049   Pages: 3
Recorded: 06/19/2006
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
NONE
Issue Dt:
Application #:
11396572
Filing Dt:
04/04/2006
Publication #:
Pub Dt:
10/11/2007
Title:
Plating apparatus and plating method
Assignors
1
Exec Dt:
04/07/2006
2
Exec Dt:
04/07/2006
3
Exec Dt:
04/07/2006
4
Exec Dt:
04/07/2006
5
Exec Dt:
04/07/2006
Assignee
1
11-1, HANEDA ASAHI-CHO, OHTA-KU
TOKYO, JAPAN
Correspondence name and address
WENDEROTH, LIND & PONACK, L.L.P.
ATTN: W. DOUGLAS HAHM, ESQ.
2033 K STREET, N.W., SUITE 800
WASHINGTON, DC 20006-1021

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