Patent Assignment Details
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| Reel/Frame: | 018004/0022 | |
| Pages: | 3 |
| | Recorded: | 06/15/2006 | | |
| Attorney Dkt #: | 5207-0146us1 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11453105
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Filing Dt:
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06/15/2006
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Publication #:
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Pub Dt:
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12/20/2007
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Title:
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Stacking structure of chip package
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Assignee
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| NO 26, DATONG RD., HSINCHU INDUSTRIAL PARK |
| HUKOU HSINCHU, TAIWAN ROC |
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Correspondence name and address
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JOE MCKINNEY MUNCY
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BIRCH, STEWART, KOLASCH, ET AL
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8110 GATEHOUSE ROAD SUITE 100 EAST
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P.O. BOX 747
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FALLS CHURCH, VA 22040-0747
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