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Reel/Frame:018004/0208   Pages: 4
Recorded: 06/16/2006
Attorney Dkt #:wilkg193.001aus
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
10/04/2011
Application #:
11454356
Filing Dt:
06/16/2006
Publication #:
Pub Dt:
12/20/2007
Title:
IC PACKAGES WITH INTERNAL HEAT DISSIPATION STRUCTURES
Assignors
1
Exec Dt:
06/06/2006
2
Exec Dt:
06/06/2006
3
Exec Dt:
06/13/2006
Assignee
1
5TH FLOOR, 2 SCIENCE PARK AVENUE
HONG KONG SCIENCE PARK
PAK SHEK KOK, SHATIN, NEW TERRITORIES, HONG KONG
Correspondence name and address
KNOBBE, MARTENS, OLSON & BEAR, LLP
2040 MAIN STREET
14TH FLOOR
IRVINE, CA 92614

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