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Patent Assignment Details
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Reel/Frame:018060/0797   Pages: 6
Recorded: 06/28/2006
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
04/01/2008
Application #:
11476297
Filing Dt:
06/28/2006
Publication #:
Pub Dt:
04/19/2007
Title:
HIGH DENSITY, HIGH SPEED CONNECTOR
Assignors
1
Exec Dt:
04/20/2006
2
Exec Dt:
04/20/2006
3
Exec Dt:
04/20/2006
4
Exec Dt:
04/20/2006
5
Exec Dt:
04/20/2006
6
Exec Dt:
04/20/2006
Assignee
1
NO. 2, TZU YU STREET
TU-CHEN CITY, TAIPEI HSIEN, TAIWAN
Correspondence name and address
WEI TE CHUNG
FOXCONN INTERNATIONAL, INC.
1650 MEMOREX DRIVE
SANTA CLARA, CA 95050

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