Patent Assignment Details
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Reel/Frame: | 018087/0198 | |
| Pages: | 3 |
| | Recorded: | 08/11/2006 | | |
Attorney Dkt #: | MSI-GENERAL |
Conveyance: | RELEASE OF SECURITY INTEREST |
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Total properties:
1
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Patent #:
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Issue Dt:
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06/18/2002
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Application #:
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09324342
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Filing Dt:
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06/02/1999
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Title:
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METHODS FOR WAFER TO WAFER BONDING USING MICROSTRUCTURES
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Assignee
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1000 LUCAS WAY |
HAMPTON, VIRGINIA 23666 |
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Correspondence name and address
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PLEVY, HOWARD & DARCY, PC
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P.O. BOX 226
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FORT WASHINGTON, PA 19034
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