Patent Assignment Details
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| Reel/Frame: | 018134/0669 | |
| Pages: | 4 |
| | Recorded: | 08/17/2006 | | |
| Attorney Dkt #: | 9319S-001759 |
| Conveyance: | CORRECTIVE ASSIGNMENT TO CORRECT THE ASSIGNOR'S NAME PREVIOUSLY RECORDED ON REEL 017934, FRAME 0286. ASSIGNOR HEREBY CONFIRMS THE ASSIGNMENT OF THE ENTIRE INTEREST. |
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Total properties:
1
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Patent #:
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Issue Dt:
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07/13/2010
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Application #:
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11457505
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Filing Dt:
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07/14/2006
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Publication #:
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Pub Dt:
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02/01/2007
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Title:
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BONDING PAD FABRICATION METHOD, METHOD FOR FABRICATING A BONDING PAD AND AN ELECTRONIC DEVICE, AND ELECTRONIC DEVICE
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Assignee
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| 4-1 NISHI-SHINJUKU, 2-CHOME |
| SHINJUKU-KU |
| TOKYO, JAPAN |
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Correspondence name and address
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G. GREGORY SCHIVLEY
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HARNESS, DICKEY & PIERCE, P.L.C.
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P.O. BOX 828
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BLOOMFIELD HILLS, MI 48303
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