Patent Assignment Details
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| Reel/Frame: | 018138/0144 | |
| Pages: | 4 |
| | Recorded: | 07/31/2006 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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06/17/2008
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Application #:
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11449107
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Filing Dt:
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06/08/2006
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Publication #:
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Pub Dt:
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12/14/2006
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Title:
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WIRING SUBSTRATE AND BONDING PAD COMPOSITION
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Assignee
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| 14-18 TAKATSUJI-CHO |
| MIZUHO-KU, NAGOYA, JAPAN 467-8525 |
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Correspondence name and address
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MARK KUSNER, KUSNER & JAFFE
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HIGHLAND PLACE - SUITE 310
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6151 WILSON MILLS ROAD
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HIGHLAND HEIGHTS, OHIO 44143
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