Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 018139/0968 | |
| Pages: | 2 |
| | Recorded: | 07/28/2006 | | |
| Attorney Dkt #: | 8053-1052 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11494484
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Filing Dt:
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07/28/2006
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Publication #:
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Pub Dt:
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02/01/2007
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Title:
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Multi-chip semiconductor package featuring wiring chip incorporated therein, and method for manufacturing such multi-chip semiconductor package
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Assignee
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| 1753 SHIMONUMABE, NAKAHARA-KU |
| KAWASAKI, KANAGAWA 211-8668, JAPAN |
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Correspondence name and address
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YOUNG & THOMPSON
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745 SOUTH 23RD STREET
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2ND FLOOR
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ARLINGTON, VA 22202
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