Patent Assignment Details
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| Reel/Frame: | 018158/0886 | |
| Pages: | 3 |
| | Recorded: | 08/04/2006 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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10/26/2010
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Application #:
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11499404
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Filing Dt:
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08/04/2006
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Publication #:
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Pub Dt:
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03/15/2007
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Title:
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METHOD FOR UNLOADING THERMALLY TREATED NON-PLANAR SILICON WAFERS WTH CONVEYING BLADE
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Assignee
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| 2-1, SHIBAURA 1-CHOME, MINATO-KU |
| TOKYO, 105-8634, JAPAN |
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Correspondence name and address
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SUGHRUE MION, PLLC
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401 CASTRO STREET, STE 220
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MOUNTAIN VIEW, CA 94041-2007
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