Patent Assignment Details
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Reel/Frame: | 018163/0383 | |
| Pages: | 2 |
| | Recorded: | 08/24/2006 | | |
Attorney Dkt #: | 36856.1458 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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07/06/2010
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Application #:
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10597919
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Filing Dt:
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08/11/2006
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Publication #:
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Pub Dt:
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07/12/2007
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Title:
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MULTILAYER SUBSTRATE WITH BUILT-IN-CHIP-TYPE ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME
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Assignee
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10-1 HIGASHIKOTARI, 1-CHOME |
NAGAOKAKYO-SHI |
KYOTO-FU, JAPAN 617-8555 |
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Correspondence name and address
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KEATING & BENNETT LLP
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8180 GREENSBORO DRIVE
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SUITE 850
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MCLEAN, VA 22102
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