Patent Assignment Details
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| Reel/Frame: | 018251/0383 | |
| Pages: | 3 |
| | Recorded: | 08/30/2006 | | |
| Attorney Dkt #: | 06592/LH |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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12/04/2007
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Application #:
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11512837
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Filing Dt:
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08/30/2006
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Publication #:
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Pub Dt:
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03/15/2007
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Title:
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POLISHING METHOD FOR SEMICONDUCTOR WAFER
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Assignee
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| 25-1, SHINOMIYA 3-CHOME, HIRATSUKA-SHI |
| KANAGAWA 254-0014, JAPAN |
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Correspondence name and address
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FRISHAUF, HOLTZ, GOODMAN & CHICK, P.C.
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220 FIFTH AVENUE, 16TH FLOOR
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NEW YORK, NEW YORK 10001-7708
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