Patent Assignment Details
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| Reel/Frame: | 018286/0765 | |
| Pages: | 3 |
| | Recorded: | 09/11/2006 | | |
| Attorney Dkt #: | FPA-20060259NECUSJTC |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11518278
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Filing Dt:
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09/11/2006
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Publication #:
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Pub Dt:
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04/05/2007
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Title:
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Semiconductor device having high-density contact holes with oval plane shape arranged to reduce malfunction resulting from bowing during etching
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Assignee
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| 2-1, YAESU 2-CHOME, CHUO-KU, |
| TOKYO, JAPAN 104-0028 |
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Correspondence name and address
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SEAN M. MCGINN, ESQ.
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MCGINN IP LAW GROUP, PLLC
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8321 OLD COURTHOUSE ROAD, SUITE 200
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VIENNA, VIRGINIA 22182-3817
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