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Patent Assignment Details
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Reel/Frame:018286/0986   Pages: 2
Recorded: 09/11/2006
Attorney Dkt #:85A 3852
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
NONE
Issue Dt:
Application #:
11480179
Filing Dt:
06/30/2006
Publication #:
Pub Dt:
01/04/2007
Title:
Bonding apparatus and method
Assignor
1
Exec Dt:
08/18/2006
Assignee
1
2-51-1, INADAIRA
MUSASHIMURAYAMA-SHI, TOKYO, JAPAN
Correspondence name and address
WILLIAM L. ANDROLIA
KODA & ANDROLIA
2029 CENTURY PARK EAST, SUITE 1140
LOS ANGELES, CA 90067-1140

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