Patent Assignment Details
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Reel/Frame: | 018286/0986 | |
| Pages: | 2 |
| | Recorded: | 09/11/2006 | | |
Attorney Dkt #: | 85A 3852 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11480179
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Filing Dt:
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06/30/2006
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Publication #:
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Pub Dt:
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01/04/2007
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Title:
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Bonding apparatus and method
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Assignee
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2-51-1, INADAIRA |
MUSASHIMURAYAMA-SHI, TOKYO, JAPAN |
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Correspondence name and address
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WILLIAM L. ANDROLIA
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KODA & ANDROLIA
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2029 CENTURY PARK EAST, SUITE 1140
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LOS ANGELES, CA 90067-1140
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