|
Total properties:
30
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|
|
|
Patent #:
|
|
Issue Dt:
|
11/02/1993
|
Application #:
|
07918454
|
Filing Dt:
|
07/22/1992
|
|
Title:
|
IMIDAZOLE-SILANE COMPOUNDS AND METAL SURFACE FINISHING AGENT CONTAINING THE SAME
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|
|
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|
Patent #:
|
|
Issue Dt:
|
04/16/1996
|
Application #:
|
08346009
|
Filing Dt:
|
11/29/1994
|
|
Title:
|
NOVEL TANTALUM COMPOUND, PROCESS OF PRODUCING THE SAME, AND MATERIAL FOR FORMING TANTALUM OXIDE FILMS
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|
|
|
|
Patent #:
|
|
Issue Dt:
|
11/19/2002
|
Application #:
|
09813758
|
Filing Dt:
|
03/21/2001
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|
Publication #:
|
|
Pub Dt:
|
08/23/2001
| | | | |
|
Title:
|
MOLYBDENUM SOAP-CONTAINING METALLIC SOAP AND METHOD FOR PRODUCING THE SAME
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|
|
|
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Patent #:
|
|
Issue Dt:
|
03/23/2004
|
Application #:
|
09936073
|
Filing Dt:
|
09/05/2001
|
|
Publication #:
|
|
Pub Dt:
|
05/08/2003
| | | | |
|
Title:
|
MONOCARBOXYLATE SALTS OF IMIDAZOLE REACTION PRODUCTS, PROCESS FOR PREPARING THE SALTS, AND SURFACE TREATMENTS, ADDITIVES FOR RESINS, AND RESIN COMPOSITIONS, CONTAINING THE SAME
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|
|
|
|
Patent #:
|
|
Issue Dt:
|
08/12/2003
|
Application #:
|
10009902
|
Filing Dt:
|
12/10/2001
|
|
Publication #:
|
|
Pub Dt:
|
03/20/2003
| | | | |
|
Title:
|
METAL SURFACE TREATMENT AGENT, AND METAL MATERIAL COATED WITH SAME
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|
|
|
|
Patent #:
|
|
Issue Dt:
|
10/26/2004
|
Application #:
|
10166117
|
Filing Dt:
|
06/10/2002
|
|
Publication #:
|
|
Pub Dt:
|
02/20/2003
| | | | |
|
Title:
|
ADHESION ACCELERATOR FOR BONDING RUBBER TO METAL AND RUBBER COMPOSITION
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
07/26/2005
|
Application #:
|
10169893
|
Filing Dt:
|
07/08/2002
|
|
Publication #:
|
|
Pub Dt:
|
01/23/2003
| | | | |
|
Title:
|
WATER-BASED METAL SURFACE TREATMENT AGENT
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
08/24/2004
|
Application #:
|
10169894
|
Filing Dt:
|
07/08/2002
|
|
Publication #:
|
|
Pub Dt:
|
12/19/2002
| | | | |
|
Title:
|
PRETREATING AGENT FOR METAL PLATING
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
12/28/2004
|
Application #:
|
10362953
|
Filing Dt:
|
05/01/2003
|
|
Publication #:
|
|
Pub Dt:
|
08/05/2004
| | | | |
|
Title:
|
SURFACE TREATMENT FOR COPPER FOIL
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
08/22/2006
|
Application #:
|
10450421
|
Filing Dt:
|
06/12/2003
|
|
Publication #:
|
|
Pub Dt:
|
02/19/2004
| | | | |
|
Title:
|
BASIC SILANE COUPLING AGENT ORGANIC CARBOXYLATE COMPOSITION, METHOD FOR PRODUCING THE SAME, AND EPOXY RESIN COMPOSITION CONTAINING THE SAME
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
07/12/2005
|
Application #:
|
10451977
|
Filing Dt:
|
06/25/2003
|
|
Publication #:
|
|
Pub Dt:
|
04/22/2004
| | | | |
|
Title:
|
ORGANIC CARBOXYLIC ACID SALT COMPOSITION, PROCESS FOR PREPARATION THEREOF AND ADDITIVES FOR EPOXY RESINS
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
02/20/2007
|
Application #:
|
10472678
|
Filing Dt:
|
09/18/2003
|
|
Publication #:
|
|
Pub Dt:
|
11/25/2004
| | | | |
|
Title:
|
ELECTROLESS PLATING METHOD AND SEMICONDUCTOR WAFER ON WHICH METAL PLATING LAYER IS FORMED
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
02/28/2006
|
Application #:
|
10479896
|
Filing Dt:
|
12/03/2003
|
|
Publication #:
|
|
Pub Dt:
|
08/05/2004
| | | | |
|
Title:
|
COPPER ELECTROLYTIC SOLUTION CONTAINING AMINE COMPOUND HAVING SPECIFIC SKELETON AND ORGANOSULFUR COMPOUND AS ADDITIVES, AND ELECTROLYTIC COPPER FOIL PRODUCED USING THE SAME
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
12/05/2006
|
Application #:
|
10480710
|
Filing Dt:
|
12/11/2003
|
|
Publication #:
|
|
Pub Dt:
|
08/11/2005
| | | | |
|
Title:
|
COPPER ELECTROLYTIC SOLUTION CONTAINING ORGANIC SULFUR COMPOUND AND QUATERNARY AMINE COMPOUND OF SPECIFIED SKELETON AS ADDITIVES AND ELECTROLYTIC COPPER FOIL PRODUCED THEREWITH
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
09/19/2006
|
Application #:
|
10480712
|
Filing Dt:
|
12/11/2003
|
|
Publication #:
|
|
Pub Dt:
|
07/28/2005
| | | | |
|
Title:
|
SOLID SILANE COUPLING AGENT COMPOSITION, PROCESS FOR PRODUCING THE SAME, AND RESIN COMPOSITION CONTAINING THE SAME
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
01/11/2011
|
Application #:
|
10482092
|
Filing Dt:
|
12/19/2003
|
|
Publication #:
|
|
Pub Dt:
|
07/07/2005
| | | | |
|
Title:
|
METAL PLATING METHOD AND PRETREATMENT AGENT
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
01/26/2010
|
Application #:
|
10486274
|
Filing Dt:
|
02/05/2004
|
|
Publication #:
|
|
Pub Dt:
|
10/21/2004
| | | | |
|
Title:
|
SURFACE TREATED COPPER FILM
|
|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
10486861
|
Filing Dt:
|
02/11/2004
|
|
Publication #:
|
|
Pub Dt:
|
01/19/2006
| | | | |
|
Title:
|
Copper electrolytic solution containing quaternary amine compound polymer with specific skeleton and organo-sulfur compound as additives, and electrolytic copper foil manufactured using the same
|
|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
10515708
|
Filing Dt:
|
11/23/2004
|
|
Publication #:
|
|
Pub Dt:
|
06/22/2006
| | | | |
|
Title:
|
Novel imidazole alcohol compound, process for producing the same, and surface-treating agent comprising the same
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
08/17/2010
|
Application #:
|
10531645
|
Filing Dt:
|
04/15/2005
|
|
Publication #:
|
|
Pub Dt:
|
07/27/2006
| | | | |
|
Title:
|
COPPER ELECTROLYTIC SOLUTION AND ELECTROLYTIC COPPER FOIL PRODUCED THEREWITH
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
11/27/2007
|
Application #:
|
10549537
|
Filing Dt:
|
09/15/2005
|
|
Publication #:
|
|
Pub Dt:
|
05/03/2007
| | |
PCT #:
|
JP0505936
|
|
Title:
|
ELECTROLESS GOLD PLATING LIQUID
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
05/22/2012
|
Application #:
|
10558172
|
Filing Dt:
|
11/22/2005
|
|
Publication #:
|
|
Pub Dt:
|
10/19/2006
| | |
PCT #:
|
JP0404674
|
|
Title:
|
METHOD FOR ELECTROLESS PLATING AND METAL-PLATED ARTICLE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
09/02/2008
|
Application #:
|
10558173
|
Filing Dt:
|
11/22/2005
|
|
Publication #:
|
|
Pub Dt:
|
10/19/2006
| | |
PCT #:
|
JP0401784
|
|
Title:
|
ELECTROLESS GOLD PLATING LIQUID
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
06/24/2008
|
Application #:
|
10570394
|
Filing Dt:
|
03/02/2006
|
|
Publication #:
|
|
Pub Dt:
|
11/30/2006
| | |
PCT #:
|
JP0511545
|
|
Title:
|
ELECTROLESS GOLD PLATING SOLUTION
|
|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
10575336
|
Filing Dt:
|
04/07/2006
|
|
Publication #:
|
|
Pub Dt:
|
05/31/2007
| | |
PCT #:
|
JP0414814
|
|
Title:
|
Resin composition
|
|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
10576230
|
Filing Dt:
|
04/14/2006
|
|
Publication #:
|
|
Pub Dt:
|
03/29/2007
| | |
PCT #:
|
JP0414049
|
|
Title:
|
Electroless copper plating solution and electroless copper plating method
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
03/26/2013
|
Application #:
|
10576231
|
Filing Dt:
|
04/14/2006
|
|
Publication #:
|
|
Pub Dt:
|
02/22/2007
| | |
PCT #:
|
JP0411327
|
|
Title:
|
ELECTROLESS COPPER PLATING SOLUTION
|
|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
10576658
|
Filing Dt:
|
04/20/2006
|
|
Publication #:
|
|
Pub Dt:
|
05/31/2007
| | |
PCT #:
|
JP0415707
|
|
Title:
|
Inkjet ink composition
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
05/16/2006
|
Application #:
|
10767697
|
Filing Dt:
|
01/29/2004
|
|
Publication #:
|
|
Pub Dt:
|
09/23/2004
| | | | |
|
Title:
|
METAL PLATING METHOD, PRETREATMENT AGENT, AND SEMICONDUCTOR WAFER AND SEMICONDUCTOR DEVICE OBTAINED USING THESE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
05/27/2008
|
Application #:
|
11187282
|
Filing Dt:
|
07/22/2005
|
|
Publication #:
|
|
Pub Dt:
|
11/17/2005
| | | | |
|
Title:
|
COPPER ELECTROLYTIC SOLUTION CONTAINING AMINE COMPOUND HAVING SPECIFIC SKELETON AND ORGANOSULFUR COMPOUND AS ADDITIVES, AND ELECTROLYTIC COPPER FOIL PRODUCED USING THE SAME
|
|
