Patent Assignment Details
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Reel/Frame: | 018319/0994 | |
| Pages: | 4 |
| | Recorded: | 09/15/2006 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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04/07/2009
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Application #:
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11521753
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Filing Dt:
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09/15/2006
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Publication #:
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Pub Dt:
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03/20/2008
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Title:
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STACKED MULTI-CHIP PACKAGE WITH EMI SHIELDING
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Assignee
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3RD FLOOR, BUILDING 6, 2 SCIENCE PARK WEST AVENUE, HONG KONG SCIENCE PARK |
SHATIN, NEW TERRITORIES, HONG KONG |
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Correspondence name and address
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DEEPAK MALHOTRA
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WELLS ST. JOHN P.S.
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601 WEST FIRST AVENUE
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SUITE 1300
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SPOKANE, WA 99201-3828
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