Patent Assignment Details
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| Reel/Frame: | 018322/0635 | |
| Pages: | 5 |
| | Recorded: | 09/21/2006 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11413900
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Filing Dt:
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04/28/2006
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Publication #:
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Pub Dt:
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11/01/2007
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Title:
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Plasma etch process using polymerizing etch gases and an inert diluent gas in independent gas injection zones to improve etch profile or etch rate uniformity
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Assignee
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| P.O. BOX 540A |
| LEGAL AFFAIRS DEPT., M/S 2061-LEGAL |
| SANTA CLARA, CALIFORNIA 95052 |
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Correspondence name and address
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ROBERT M. WALLACE
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LAW OFFICE OF ROBERT M. WALLACE
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2112 EASTMAN AVENUE, SUITE 102
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VENTURA, CALIFORNIA 93003
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