Patent Assignment Details
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| Reel/Frame: | 018343/0071 | |
| Pages: | 4 |
| | Recorded: | 09/25/2006 | | |
| Attorney Dkt #: | 296859US0 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11525813
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Filing Dt:
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09/25/2006
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Publication #:
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Pub Dt:
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05/17/2007
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Title:
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Layer forming method, layer forming apparatus, workpiece processing apparatus, interconnect forming method, and substrate interconnect structure
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Assignee
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| 11-1, HANEDA ASAHI-CHO |
| OHTA-KU, TOKYO, JAPAN |
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Correspondence name and address
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C. IRVIN MCCLELLAND
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OBLON, SPIVAK, MCCLELLAND, MAIER & NEUST
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1940 DUKE STREET
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ALEXANDRIA, VA 22314
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