Patent Assignment Details
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| Reel/Frame: | 018378/0255 | |
| Pages: | 2 |
| | Recorded: | 10/03/2006 | | |
| Attorney Dkt #: | 069576-0141 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11541676
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Filing Dt:
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10/03/2006
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Publication #:
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Pub Dt:
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04/12/2007
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Title:
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Method of manufacturing thin film capacitor and printed circuit board having thin film capacitor embedded therein
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Assignee
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| 314 MAETAN-3-DONG, YOUNGTONG-KU |
| SUWON, KYUNGKI-DO, KOREA, REPUBLIC OF |
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Correspondence name and address
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MCDERMOTT WILL & EMERY LLP
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600 13TH STREET, N.W.
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WASHINGTON, D.C. 20005-3096
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