Patent Assignment Details
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| Reel/Frame: | 018401/0164 | |
| Pages: | 3 |
| | Recorded: | 10/11/2006 | | |
| Attorney Dkt #: | NEC-655-US/TN |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11545467
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Filing Dt:
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10/11/2006
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Publication #:
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Pub Dt:
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05/03/2007
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Title:
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Soldering method for mounting semiconductor device on wiring board to ensure invariable gap therebetween, and soldering apparatus therefor
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Assignee
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| 1753 SHIMONUMABE, NAKAHARA-KU |
| KAWASAKI, KANAGAWA, JAPAN 211-8668 |
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Correspondence name and address
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SEAN M. MCGINN, ESQ.
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MCGINN IP LAW GROUP, PLLC
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8321 OLD COURTHOUSE ROAD, SUITE 200
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VIENNA, VIRGINIA 22182-3817
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